Chapter 8486 — Customs Tariff Headings

8486.20.00Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits

8486.30.00Machines and apparatus for the manufacture of flat panel displays

8486.40Machines and apparatus specified in Note 11 (C) to this Chapter

8486.90.00Parts and accessories

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Products classified under Tariff item 84.86

Automated Wafer Edge Grinder

An automated wafer edge grinder that chamfers and profiles the edges of semiconductor wafers after they are sliced from a boule. This process prevents chipping and cracking during subsequent handling and processing steps, which is critical for maintaining high yields in semiconductor fabrication. It is classified under this tariff item because it is used solely or principally for the manufacture of wafers.

Chemical Mechanical Wafer Polisher

A chemical mechanical wafer polisher that uses a slurry and polishing pad to planarize semiconductor wafers, achieving sub-micron flatness required for advanced lithography. It includes in-situ endpoint detection to control the polishing process precisely. This machine is used solely or principally for wafer manufacture, making it classifiable under this tariff item.

Crystal boule Diameter Grinder

A crystal boule diameter grinder that shapes semiconductor boules to a uniform diameter before slicing, ensuring consistent wafer thickness. It also creates orientation flats used for doping identification. This machine is essential for preparing boules for wafer production and falls under this tariff item as it is used solely or principally for boule manufacture.

Czochralski Crystal Puller

A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules, such as silicon, by dipping a seed crystal into a melt and slowly pulling it to form a single crystal. This machine is fundamental to wafer manufacturing and is classified under this tariff item as it is used solely or principally for boule production.

Double-Sided Wafer Grinder

A double-sided wafer grinder that processes both faces of a semiconductor wafer simultaneously to achieve parallel thickness control, essential for device uniformity. It uses planetary motion with diamond pads for precision grinding. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.

Float Zone Crystal Grower

A float zone crystal grower that produces high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. This method is ideal for applications requiring low oxygen content. It is classified under this tariff item as it is used solely or principally for boule manufacture.

Gallium Arsenide Boule Puller

A gallium arsenide boule puller that produces monocrystalline GaAs boules using the liquid-encapsulated Czochralski method for compound semiconductor applications like LEDs and RF chips. It handles reactive melts safely. This machine is used solely or principally for boule manufacture and falls under this tariff item.

Multi-Wire Wafer Slicing Saw

A multi-wire wafer slicing saw that uses diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. It is used for high-volume silicon wafer production. This machine is essential for wafer manufacture and is classified under this tariff item.

Precision Wafer Slicer

A precision wafer slicer that uses inner-diameter diamond saws for kerfless wafering from semiconductor boules, minimizing waste for thin wafers. It is designed for high-precision slicing. This machine is used solely or principally for wafer manufacture and falls under this tariff item.

Semiconductor Wafer Lapper

A semiconductor wafer lapper that uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specifications. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.

SEMI Wafer Grinder-Polisher Combo

A SEMI wafer grinder-polisher combo that performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. It is integrated for efficient wafer preparation. This machine is used solely or principally for wafer manufacture and falls under this tariff item.

Silicon Crystal Grinder

A silicon crystal grinder that processes semiconductor boules by grinding them to precise diameters and creating flats that indicate conductivity type and resistivity. It prepares the boule for wafer slicing. This machine is used solely or principally for boule manufacture and is classified under this tariff item.

Silicon Ingot Grinder

A silicon ingot grinder that shapes Czochralski-grown ingots to exact geometry before wire sawing, creating reference flats. It ensures the ingot is ready for wafer slicing. This machine is used solely or principally for boule manufacture and falls under this tariff item.

Silicon Wafer Polishing Machine

A silicon wafer polishing machine that uses chemical-mechanical planarization (CMP) to create mirror-finish wafer surfaces for semiconductor lithography. It brings wafers to final tolerances before fab processing. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.

Wafer Slicing Diamond Saw

A wafer slicing diamond saw that cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. This machine is used solely or principally for wafer manufacture and falls under this tariff item.

Chemical Mechanical Wafer Polisher

Chemical mechanical polishing (CMP) tools polish semiconductor wafers to atomic-level flatness using a combination of chemical slurry and mechanical pads. This process is critical for planarizing layers during integrated circuit fabrication, ensuring subsequent lithography and etching steps are accurate. CMP tools are essential for semiconductor device manufacturing, falling under this tariff item.

Chemical Vapor Deposition Furnace

Chemical vapor deposition (CVD) furnaces deposit thin films of insulators, metals, or semiconductors onto wafers through gas-phase chemical reactions. These films are essential for creating the layers of integrated circuits, providing conformal coatings with precise thickness control. CVD furnaces are a core piece of equipment in semiconductor device manufacturing.

Crystal Boule Grinder

Crystal boule grinders shape semiconductor boules to precise diameters and grind flats that indicate conductivity type and resistivity. This preparation step is essential before slicing the boule into wafers for semiconductor device manufacturing. The grinder is a machine used solely or principally for the manufacture of semiconductor boules.

Czochralski Crystal Puller

A Czochralski crystal puller produces extremely pure monocrystalline silicon boules by pulling a seed crystal from molten silicon. These boules are the starting material for semiconductor wafers used in electronic integrated circuits. The puller is a machine used solely or principally for the manufacture of semiconductor boules.

Dielectric Film Sputtering System

Dielectric film sputtering systems use plasma sputtering to deposit thin dielectric and metal films onto semiconductor wafers. These films are crucial for creating insulating and conductive layers in integrated circuits. Sputtering systems are essential for semiconductor device manufacturing, providing pinhole-free films with precise thickness.

Float Zone Crystal Grower

Float zone crystal growers produce monocrystalline semiconductor boules using the float zone method, which is ideal for high-purity silicon wafers. This method is used for applications requiring extremely low impurity levels in electronic integrated circuits. The grower is a machine used solely or principally for the manufacture of semiconductor boules.

Ion Implantation System

High-energy ion implanters dope semiconductor wafers with precise impurity concentrations to form transistors and other structures in integrated circuits. This process controls dopant depth and profile, which is critical for device performance. Ion implantation systems are essential for semiconductor device manufacturing.

Photolithography Wafer Stepper

Photolithography wafer steppers expose circuit patterns onto photoresist-coated semiconductor wafers using projection optics. This process is fundamental to defining the microscopic features of integrated circuits. Wafer steppers are a core piece of equipment in semiconductor device manufacturing.

Plasma Etching Reactor

Plasma etching reactors use reactive ion etching to anisotropically remove material from semiconductor wafers, defining circuit patterns with high precision. This process is essential for creating the intricate structures of integrated circuits. Plasma etching reactors are core semiconductor device processing apparatus.

Semiconductor Wafer Metrology Tool

In-line metrology tools measure wafer thickness, overlay, and critical dimensions during semiconductor device manufacturing for process control. These tools are integral to ensuring the quality and yield of integrated circuits. Metrology tools used in the fabrication process are classified under this tariff item.

Semiconductor Wafer Slicing Saw

Wafer slicing saws precisely cut monocrystalline semiconductor boules into thin wafers for device fabrication, using diamond wire or blades. This step is essential for producing the wafers that will undergo semiconductor device manufacturing. The saw is a machine used solely or principally for the manufacture of semiconductor wafers.

Silicon Wafer Cleaning Station

Automated cleaning stations remove particles and contaminants from semiconductor wafers using megasonic, brush, or chemical methods before processing. This cleaning is essential for maintaining the purity and quality of wafers during integrated circuit fabrication. Cleaning stations are used in semiconductor device manufacturing.

Wafer Annealing Oven

Rapid thermal annealing ovens activate dopants and repair lattice damage in semiconductor wafers after ion implantation. This process is critical for ensuring the electrical properties of integrated circuits. Wafer annealing ovens are used in semiconductor device manufacturing.

Wafer Edge Grinding Machine

Wafer edge grinding machines profile the edges of semiconductor wafers to prevent chipping and ensure safe handling during fabrication. This edge profiling is essential for maintaining wafer integrity throughout the manufacturing process. Edge grinding machines are used in semiconductor device manufacturing.

Wafer Lapping Machine

Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. This preparation is essential for ensuring the quality of wafers used in integrated circuits. Lapping machines are used in semiconductor device manufacturing.

Array Tester for LCD Panels

An automated optical inspection system designed to test electrical and visual defects in completed LCD array panels before cell assembly. It is integral to the flat panel display manufacturing process, ensuring quality control of the array substrate.

Chemical Mechanical Planarization Polisher for Displays

A chemical mechanical planarization (CMP) tool that polishes dielectric and metal layers on flat panel display substrates using slurry and polishing pads to achieve uniform surfaces. It is essential for producing smooth layers in FPD fabrication, particularly for advanced display technologies.

Flat Panel Display Encapsulation Oven

A thermal curing oven that applies thin-film encapsulation to protect OLED panels from moisture and oxygen, extending display lifetime and reliability. It is a critical apparatus in the production of OLED flat panel displays.

Flat Panel Display Laser Scribing Machine

A precision laser system used to scribe circuit patterns and cut panels from mother glass sheets in flat panel display fabrication lines. It enables high-speed, accurate cutting and patterning essential for producing individual display panels.

FPD Sputtering Target Deposition System

A magnetron sputtering system that deposits conductive and insulating films, such as indium tin oxide (ITO), onto large flat panel display substrates. It handles Gen 8+ substrates and is a principal apparatus for layer formation in FPD manufacturing.

FPD Substrate Cleaning Station

A megasonic and chemical cleaning system that removes particles from glass substrates prior to thin-film deposition in flat panel display production. It achieves sub-50nm particle removal, ensuring substrate cleanliness critical for display quality.

Inkjet Printer for OLED Pixel Deposition

A high-precision inkjet system that deposits RGB organic materials directly onto substrates for printable OLED displays. It enables cost-effective large-area display production and is specialized for flat panel display manufacturing.

LCD Photolithography Exposure System

A photolithography exposure system that projects precise patterns onto photoresist-coated LCD panels using ultraviolet light and masks. It is essential for creating thin-film transistor arrays in flat panel displays, a core step in FPD manufacturing.

OLED Vacuum Deposition Chamber

A high-vacuum system that deposits organic thin films and electrodes onto substrates for OLED flat panel displays through evaporation or sputtering. It plays a principal role in the manufacture of OLED displays, ensuring uniform layer deposition.

Plasma Etching Reactor for TFT Panels

A reactive ion etching system that removes material from TFT layers on glass substrates using plasma in flat panel display production. It is a dedicated apparatus for FPD manufacturing, enabling precise patterning of thin-film transistors.

300mm Wafer Transfer Robot

High-precision robot with dual-arm capability for transferring 300mm silicon wafers between cluster tools in semiconductor fabrication facilities. It integrates with an Equipment Front End Module (EFEM) and is dedicated to wafer handling, which is a function specified in Note 11 (C) (iii) to Chapter 84.

Binary Mask Etching Equipment

> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.

Chemical Mechanical Wafer Polisher

> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.

Chip Mounter for IC Assembly Lines

>- A high-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats, with vision-guided placement. It is classified under tariff item 8486.40.00 as machinery for assembling electronic integrated circuits.

Crystal Boule Grinder

> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.

Crystal Boule Lifting Manipulator

Precision manipulator designed for lifting and transferring monocrystalline silicon boules from crystal growers to slicing stations. It handles heavy, fragile semiconductor material and is built specifically for that purpose, falling under Note 11 (C) (iii) of Chapter 84.

Czochralski Crystal Puller

> A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules from molten silicon, which are then sliced into wafers. This apparatus is essential for the initial stage of semiconductor wafer manufacturing. It is classified under tariff item 8486.40.00 as it is a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.

Die Bonder Machine for Semiconductor Assembly

>- A precision machine that picks and places semiconductor dies onto lead frames or substrates using epoxy or eutectic bonding methods. It falls under tariff item 8486.40.00 as it is specifically designed for assembling semiconductor devices.

Double-Sided Wafer Lapper

> A double-sided wafer lapping machine that simultaneously processes both sides of semiconductor wafers to achieve parallelism within 1 micron, using cast iron plates and diamond slurry. This equipment is vital for preparing wafers with precise thickness and flatness for device fabrication. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.

E-Beam Mask Inspection System

> A high-resolution electron beam inspection system that detects sub-20nm defects on patterned photomasks, ensuring quality in semiconductor mask manufacturing. This machine is essential for quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.

Electron Beam Mask Writer

> An electron beam mask writer that uses electron beam lithography to directly write patterns onto photomask blanks for semiconductor reticles. This machine is critical for creating high-precision masks. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.

EUV Mask Blank Inspection Tool

> A deep ultraviolet inspection system for detecting defects in extreme ultraviolet (EUV) mask blanks before patterning, ensuring blank quality. This machine is essential for advanced semiconductor mask manufacturing. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.

Flip Chip Bonder for Semiconductor Devices

>- High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. It falls under tariff item 8486.40.00 due to its specialized role in advanced IC packaging processes.

Float Zone Crystal Grower

> A float zone crystal grower that produces monocrystalline semiconductor boules without crucibles, ideal for high-purity silicon and gallium arsenide. This apparatus uses the float zone method to achieve exceptional purity for semiconductor applications. It is classified under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.

FOUP Wafer Unloader Station

Automated station that unloads wafers from FOUP (Front Opening Unified Pod) carriers onto wafer tracks for processing tools. It features nitrogen purge and robotic transfer for contamination control, and is dedicated to semiconductor wafer handling under Note 11 (C) (iii).

Gallium Arsenide Wafer Handler

Specialized handler for compound semiconductor wafers made of gallium arsenide (GaAs) or indium phosphide (InP), used in RF and optoelectronic device production. It addresses the unique fragility of these materials and is dedicated to semiconductor wafer handling under Note 11 (C) (iii).

IC Lead Frame Stripper

>- An automated machine that separates singulated IC packages from continuous lead frames after assembly, featuring vision inspection. It falls under tariff item 8486.40.00 as essential equipment for completing semiconductor device assembly.

Laser Pattern Generator for Reticles

> A high-precision laser-based system that generates intricate patterns on chrome-on-glass reticles used in photolithography. This machine is dedicated to semiconductor mask and reticle manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.

Mask Alignment Verification System

> A metrology tool that measures overlay accuracy and pattern placement on finished photomasks before lithography use, ensuring mask quality. This machine is essential for manufacturing quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.