Automated Wafer Edge Grinder
An automated wafer edge grinder that chamfers and profiles the edges of semiconductor wafers after they are sliced from a boule. This process prevents chipping and cracking during subsequent handling and processing steps, which is critical for maintaining high yields in semiconductor fabrication. It is classified under this tariff item because it is used solely or principally for the manufacture of wafers.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the grinder is used for manufacturing semiconductor devices rather than wafers
This alternative covers machines for making semiconductor devices, which may apply if the grinder is used later in the production process.
If the grinder is a general-purpose machine not limited to semiconductor materials
This heading covers grinding machines for stone, ceramics, and similar materials, which could apply if the grinder is not exclusively for wafers.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the grinder is described as solely or principally for wafer manufacture in your commercial invoice to support classification under 8486.10.00
• Be prepared to provide technical documentation, such as user manuals or specifications, to the CBSA if requested
• Verify whether the grinder qualifies for any duty relief programs, such as the Machinery Program, which may reduce or eliminate the duty
Related Products under Tariff item 8486.10.00
Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher that uses a slurry and polishing pad to planarize semiconductor wafers, achieving sub-micron flatness required for advanced lithography. It includes in-situ endpoint detection to control the polishing process precisely. This machine is used solely or principally for wafer manufacture, making it classifiable under this tariff item.
Crystal boule Diameter Grinder
A crystal boule diameter grinder that shapes semiconductor boules to a uniform diameter before slicing, ensuring consistent wafer thickness. It also creates orientation flats used for doping identification. This machine is essential for preparing boules for wafer production and falls under this tariff item as it is used solely or principally for boule manufacture.
Czochralski Crystal Puller
A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules, such as silicon, by dipping a seed crystal into a melt and slowly pulling it to form a single crystal. This machine is fundamental to wafer manufacturing and is classified under this tariff item as it is used solely or principally for boule production.
Double-Sided Wafer Grinder
A double-sided wafer grinder that processes both faces of a semiconductor wafer simultaneously to achieve parallel thickness control, essential for device uniformity. It uses planetary motion with diamond pads for precision grinding. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
Float Zone Crystal Grower
A float zone crystal grower that produces high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. This method is ideal for applications requiring low oxygen content. It is classified under this tariff item as it is used solely or principally for boule manufacture.
Gallium Arsenide Boule Puller
A gallium arsenide boule puller that produces monocrystalline GaAs boules using the liquid-encapsulated Czochralski method for compound semiconductor applications like LEDs and RF chips. It handles reactive melts safely. This machine is used solely or principally for boule manufacture and falls under this tariff item.