Machines and apparatus for the manufacture of boules or wafers
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories. > Machines and apparatus for the manufacture of boules or wafers > Machines and apparatus for the manufacture of boules or wafers
Duty Rate (from China)
Products classified under Tariff item 8486.10.00
Automated Wafer Edge Grinder
An automated wafer edge grinder that chamfers and profiles the edges of semiconductor wafers after they are sliced from a boule. This process prevents chipping and cracking during subsequent handling and processing steps, which is critical for maintaining high yields in semiconductor fabrication. It is classified under this tariff item because it is used solely or principally for the manufacture of wafers.
Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher that uses a slurry and polishing pad to planarize semiconductor wafers, achieving sub-micron flatness required for advanced lithography. It includes in-situ endpoint detection to control the polishing process precisely. This machine is used solely or principally for wafer manufacture, making it classifiable under this tariff item.
Crystal boule Diameter Grinder
A crystal boule diameter grinder that shapes semiconductor boules to a uniform diameter before slicing, ensuring consistent wafer thickness. It also creates orientation flats used for doping identification. This machine is essential for preparing boules for wafer production and falls under this tariff item as it is used solely or principally for boule manufacture.
Czochralski Crystal Puller
A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules, such as silicon, by dipping a seed crystal into a melt and slowly pulling it to form a single crystal. This machine is fundamental to wafer manufacturing and is classified under this tariff item as it is used solely or principally for boule production.
Double-Sided Wafer Grinder
A double-sided wafer grinder that processes both faces of a semiconductor wafer simultaneously to achieve parallel thickness control, essential for device uniformity. It uses planetary motion with diamond pads for precision grinding. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
Float Zone Crystal Grower
A float zone crystal grower that produces high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. This method is ideal for applications requiring low oxygen content. It is classified under this tariff item as it is used solely or principally for boule manufacture.
Gallium Arsenide Boule Puller
A gallium arsenide boule puller that produces monocrystalline GaAs boules using the liquid-encapsulated Czochralski method for compound semiconductor applications like LEDs and RF chips. It handles reactive melts safely. This machine is used solely or principally for boule manufacture and falls under this tariff item.
Multi-Wire Wafer Slicing Saw
A multi-wire wafer slicing saw that uses diamond wire arrays to simultaneously slice multiple wafers from a boule, minimizing material waste. It is used for high-volume silicon wafer production. This machine is essential for wafer manufacture and is classified under this tariff item.
Precision Wafer Slicer
A precision wafer slicer that uses inner-diameter diamond saws for kerfless wafering from semiconductor boules, minimizing waste for thin wafers. It is designed for high-precision slicing. This machine is used solely or principally for wafer manufacture and falls under this tariff item.
Semiconductor Wafer Lapper
A semiconductor wafer lapper that uses abrasive slurries to lap wafer surfaces post-slicing, achieving flatness tolerances critical for device fabrication. It prepares wafers within dimensional specifications. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
SEMI Wafer Grinder-Polisher Combo
A SEMI wafer grinder-polisher combo that performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. It is integrated for efficient wafer preparation. This machine is used solely or principally for wafer manufacture and falls under this tariff item.
Silicon Crystal Grinder
A silicon crystal grinder that processes semiconductor boules by grinding them to precise diameters and creating flats that indicate conductivity type and resistivity. It prepares the boule for wafer slicing. This machine is used solely or principally for boule manufacture and is classified under this tariff item.
Silicon Ingot Grinder
A silicon ingot grinder that shapes Czochralski-grown ingots to exact geometry before wire sawing, creating reference flats. It ensures the ingot is ready for wafer slicing. This machine is used solely or principally for boule manufacture and falls under this tariff item.
Silicon Wafer Polishing Machine
A silicon wafer polishing machine that uses chemical-mechanical planarization (CMP) to create mirror-finish wafer surfaces for semiconductor lithography. It brings wafers to final tolerances before fab processing. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
Wafer Slicing Diamond Saw
A wafer slicing diamond saw that cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. This machine is used solely or principally for wafer manufacture and falls under this tariff item.