SEMI Wafer Grinder-Polisher Combo
A SEMI wafer grinder-polisher combo that performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. It is integrated for efficient wafer preparation. This machine is used solely or principally for wafer manufacture and falls under this tariff item.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the combo machine is used for materials other than semiconductor wafers
This heading covers grinding and polishing machines for stone, ceramics, and similar materials, which may apply if the machine is not exclusive to wafers.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the combo machine is described as solely or principally for wafer grinding and polishing in your import documents
• Provide a process flow diagram to the CBSA to confirm the machine's function
• Check if any separate components, such as polishing pads, are classified under 8486.90.00
Related Products under Tariff item 8486.10.00
Automated Wafer Edge Grinder
An automated wafer edge grinder that chamfers and profiles the edges of semiconductor wafers after they are sliced from a boule. This process prevents chipping and cracking during subsequent handling and processing steps, which is critical for maintaining high yields in semiconductor fabrication. It is classified under this tariff item because it is used solely or principally for the manufacture of wafers.
Chemical Mechanical Wafer Polisher
A chemical mechanical wafer polisher that uses a slurry and polishing pad to planarize semiconductor wafers, achieving sub-micron flatness required for advanced lithography. It includes in-situ endpoint detection to control the polishing process precisely. This machine is used solely or principally for wafer manufacture, making it classifiable under this tariff item.
Crystal boule Diameter Grinder
A crystal boule diameter grinder that shapes semiconductor boules to a uniform diameter before slicing, ensuring consistent wafer thickness. It also creates orientation flats used for doping identification. This machine is essential for preparing boules for wafer production and falls under this tariff item as it is used solely or principally for boule manufacture.
Czochralski Crystal Puller
A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules, such as silicon, by dipping a seed crystal into a melt and slowly pulling it to form a single crystal. This machine is fundamental to wafer manufacturing and is classified under this tariff item as it is used solely or principally for boule production.
Double-Sided Wafer Grinder
A double-sided wafer grinder that processes both faces of a semiconductor wafer simultaneously to achieve parallel thickness control, essential for device uniformity. It uses planetary motion with diamond pads for precision grinding. This machine is used solely or principally for wafer manufacture and is classified under this tariff item.
Float Zone Crystal Grower
A float zone crystal grower that produces high-purity monocrystalline silicon boules by melting a polycrystalline rod with a radio-frequency coil and moving the molten zone. This method is ideal for applications requiring low oxygen content. It is classified under this tariff item as it is used solely or principally for boule manufacture.