Parts and accessories
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories. > Machines and apparatus specified in Note 11 (C) to this Chapter > Parts and accessories > Parts and accessories
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Subheadings
Products classified under Tariff item 8486.90.00
Crystal Boule Grinder Chuck
A precision vacuum chuck designed to hold crystal boules securely during diameter grinding operations. This chuck is an essential part of the machinery used to shape semiconductor boules into wafers, ensuring accuracy and stability during processing.
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element used in Czochralski crystal growers to melt polysilicon for producing monocrystalline semiconductor boules. This component is crucial for the operation of the crystal growth equipment.
Float Zone Crystal Grower RF Coil
A radio frequency induction coil used in float zone crystal pullers to melt a narrow zone of polysilicon rod, producing high-purity monocrystalline silicon boules. This coil is a key component of the float zone growth process.
Semiconductor Wafer Polishing Pad
A polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to achieve a mirror surface finish. This pad is an accessory used in wafer polishing machines during semiconductor fabrication.
Silicon Wafer Slicing Diamond Wire
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers. This wire is an essential accessory for wafer slicing equipment in semiconductor manufacturing.
Wafer Edge Profiling Tool
A diamond wheel tool used for creating beveled edges on semiconductor wafers to prevent chipping during handling and processing. This tool is an accessory for wafer edge profiling equipment in semiconductor manufacturing.
Wafer Grinder Lapping Plate
A precision copper or tin lapping plate used in wafer grinders to achieve flatness tolerances on semiconductor wafers during preparation for fabrication. This plate is a part of wafer grinding equipment.