Silicon Wafer Slicing Diamond Wire
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers. This wire is an essential accessory for wafer slicing equipment in semiconductor manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the wire is considered an interchangeable tool
Interchangeable tools for machine tools may be classified under heading 82.07.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Declare the diamond wire as an accessory for wafer slicing saws under 8486.90.00
• Provide specifications showing its use in multi-wire saws
• Verify any import restrictions on diamond-coated products
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