Silicon Wafer Slicing Diamond Wire from Japan
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers. This wire is an essential accessory for wafer slicing equipment in semiconductor manufacturing.
Duty Rate — Japan → Canada
0%
Import Tips
• Declare the diamond wire as an accessory for wafer slicing saws under 8486.90.00
• Provide specifications showing its use in multi-wire saws
• Verify any import restrictions on diamond-coated products