Wafer Grinder Lapping Plate
A precision copper or tin lapping plate used in wafer grinders to achieve flatness tolerances on semiconductor wafers during preparation for fabrication. This plate is a critical component of the lapping machinery and is specifically designed for wafer planarization. It falls under this tariff item as a part of machines used solely or principally for the manufacture of semiconductor wafers.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the lapping plate is imported as a part of a general-purpose machine tool
Parts for general machine tools are classified under heading 84.66, while this item is specific to semiconductor manufacturing equipment.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the lapping plate is classified as a part of wafer grinding machinery, not as a general metal plate, which would fall under a different heading
• Have technical documentation ready to prove its specific use in semiconductor wafer planarization, such as flatness specifications and material composition
• Consider whether the plate qualifies for duty-free entry under a trade agreement, as many semiconductor manufacturing components may be eligible
Related Products under Tariff item 8486.90.00
Crystal Boule Grinder Chuck
A precision vacuum chuck designed to hold crystal boules securely during diameter grinding operations, ensuring the boule is ground to exact wafer specifications. This chuck is an integral part of the machinery used in the manufacture of semiconductor boules, as it facilitates the initial shaping process. It falls under this tariff item as a part or accessory of machines used solely or principally for the manufacture of semiconductor boules or wafers.
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element used in Czochralski crystal growers to melt polysilicon, enabling the growth of monocrystalline semiconductor boules. This component is essential for the operation of the crystal puller and is designed specifically for this machinery. It qualifies under this tariff item as a part of machines used solely or principally for the manufacture of semiconductor boules.
Float Zone Crystal Grower RF Coil
A radio frequency induction coil used in float zone crystal pullers to melt a narrow zone of a polysilicon rod, producing high-purity monocrystalline silicon boules. This coil is a critical component of the crystal growth equipment and is specifically designed for this application. It falls under this tariff item as a part of machines used solely or principally for the manufacture of semiconductor boules.
Semiconductor Wafer Polishing Pad
A polyurethane polishing pad designed for chemical mechanical planarization (CMP) of semiconductor wafers, achieving a mirror-like surface finish essential for subsequent fabrication steps. This pad is an accessory used with wafer polishing machines and is specifically engineered for semiconductor wafer processing. It qualifies under this tariff item as an accessory for machines used solely or principally for the manufacture of semiconductor wafers.
Silicon Wafer Slicing Diamond Wire
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers, a critical step in wafer preparation. This wire is an essential accessory for the slicing machinery and is specifically designed for semiconductor wafer production. It falls under this tariff item as an accessory for machines used solely or principally for the manufacture of semiconductor wafers.
Wafer Edge Profiling Tool
A diamond wheel tool used to create beveled edges on semiconductor wafers, preventing chipping during handling and subsequent processing. This tool is specifically designed for wafer edge profiling equipment and is essential for wafer preparation. It qualifies under this tariff item as an accessory for machines used solely or principally for the manufacture of semiconductor wafers.