Semiconductor Wafer Polishing Pad
A polyurethane polishing pad designed for chemical mechanical planarization (CMP) of semiconductor wafers, achieving a mirror-like surface finish essential for subsequent fabrication steps. This pad is an accessory used with wafer polishing machines and is specifically engineered for semiconductor wafer processing. It qualifies under this tariff item as an accessory for machines used solely or principally for the manufacture of semiconductor wafers.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the pad is made of a material that is considered a natural or artificial abrasive stone
Abrasive articles of stone or other mineral materials are classified under heading 68.04, not as machinery parts.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the polishing pad as an accessory to wafer polishing machinery, ensuring it is not treated as a general abrasive article, which would fall under a different chapter
• Provide technical data showing its specific design for CMP processes, such as pad hardness and surface texture specifications
• Verify whether the pad is eligible for duty-free entry under a trade agreement, as many semiconductor manufacturing inputs may qualify for preferential rates
Related Products under Tariff item 8486.90.00
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