Semiconductor Wafer Polishing Pad from Japan
A polyurethane polishing pad designed for chemical mechanical planarization (CMP) of semiconductor wafers, achieving a mirror-like surface finish essential for subsequent fabrication steps. This pad is an accessory used with wafer polishing machines and is specifically engineered for semiconductor wafer processing. It qualifies under this tariff item as an accessory for machines used solely or principally for the manufacture of semiconductor wafers.
Duty Rate — Japan → Canada
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the polishing pad as an accessory to wafer polishing machinery, ensuring it is not treated as a general abrasive article, which would fall under a different chapter
• Provide technical data showing its specific design for CMP processes, such as pad hardness and surface texture specifications
• Verify whether the pad is eligible for duty-free entry under a trade agreement, as many semiconductor manufacturing inputs may qualify for preferential rates