Electron Beam Mask Writer
> An electron beam mask writer that uses electron beam lithography to directly write patterns onto photomask blanks for semiconductor reticles. This machine is critical for creating high-precision masks. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
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Import Tips & Compliance
• > Provide CBSA with documentation proving the writer is dedicated to photomask manufacturing, including pattern writing specifications
• Check eligibility for the Machinery Program for duty relief on manufacturing equipment
• Keep technical manuals and intended use records for customs audits
Related Products under Tariff item 8486.40.00
Binary Mask Etching Equipment
> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.
Chemical Mechanical Wafer Polisher
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
Crystal Boule Grinder
> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.
Czochralski Crystal Puller
> A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules from molten silicon, which are then sliced into wafers. This apparatus is essential for the initial stage of semiconductor wafer manufacturing. It is classified under tariff item 8486.40.00 as it is a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.
Double-Sided Wafer Lapper
> A double-sided wafer lapping machine that simultaneously processes both sides of semiconductor wafers to achieve parallelism within 1 micron, using cast iron plates and diamond slurry. This equipment is vital for preparing wafers with precise thickness and flatness for device fabrication. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
E-Beam Mask Inspection System
> A high-resolution electron beam inspection system that detects sub-20nm defects on patterned photomasks, ensuring quality in semiconductor mask manufacturing. This machine is essential for quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.