Machines and apparatus specified in Note 11 (C) to this Chapter
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories. > Machines and apparatus specified in Note 11 (C) to this Chapter > Machines and apparatus specified in Note 11 (C) to this Chapter > Machines and apparatus specified in Note 11 (C) to this Chapter
Duty Rate (from China)
Products classified under Tariff item 8486.40.00.00
Binary Mask Etching Equipment
> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.
8486.40.00Chemical Mechanical Wafer Polisher
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
8486.40.00Crystal Boule Grinder
> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.
8486.40.00Czochralski Crystal Puller
> A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules from molten silicon, which are then sliced into wafers. This apparatus is essential for the initial stage of semiconductor wafer manufacturing. It is classified under tariff item 8486.40.00 as it is a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.
8486.40.00Double-Sided Wafer Lapper
> A double-sided wafer lapping machine that simultaneously processes both sides of semiconductor wafers to achieve parallelism within 1 micron, using cast iron plates and diamond slurry. This equipment is vital for preparing wafers with precise thickness and flatness for device fabrication. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
8486.40.00E-Beam Mask Inspection System
> A high-resolution electron beam inspection system that detects sub-20nm defects on patterned photomasks, ensuring quality in semiconductor mask manufacturing. This machine is essential for quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Electron Beam Mask Writer
> An electron beam mask writer that uses electron beam lithography to directly write patterns onto photomask blanks for semiconductor reticles. This machine is critical for creating high-precision masks. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00EUV Mask Blank Inspection Tool
> A deep ultraviolet inspection system for detecting defects in extreme ultraviolet (EUV) mask blanks before patterning, ensuring blank quality. This machine is essential for advanced semiconductor mask manufacturing. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Float Zone Crystal Grower
> A float zone crystal grower that produces monocrystalline semiconductor boules without crucibles, ideal for high-purity silicon and gallium arsenide. This apparatus uses the float zone method to achieve exceptional purity for semiconductor applications. It is classified under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.
8486.40.00Laser Pattern Generator for Reticles
> A high-precision laser-based system that generates intricate patterns on chrome-on-glass reticles used in photolithography. This machine is dedicated to semiconductor mask and reticle manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Mask Alignment Verification System
> A metrology tool that measures overlay accuracy and pattern placement on finished photomasks before lithography use, ensuring mask quality. This machine is essential for manufacturing quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Multi-Wire Wafer Slicer
> A multi-wire wafer slicer that uses diamond wire to simultaneously cut hundreds of wafers from semiconductor boules, minimizing kerf loss and enabling thin wafer production. This machine is essential for efficient wafer manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, specifically for wafer slicing as per Note 11(C) to Chapter 84.
8486.40.00Semiconductor Wafer Slicing Saw
> A high-precision inner-diameter saw that slices ultra-thin wafers (25-775 microns) from monocrystalline semiconductor boules while minimizing subsurface damage. This machine is critical for producing wafers with minimal defects. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
8486.40.00Silicon Ingot Grinder
> A precision grinder for shaping silicon ingots to uniform diameter prior to wafer slicing, with automatic flat generation for orientation. This machine ensures ingots meet exact specifications for downstream processing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as per Note 11(C) to Chapter 84.
8486.40.00Wafer Edge Grinder
> A wafer edge grinder that grinds wafer edges to precise chamfer profiles, preventing chipping during handling and processing. This machine is critical for 300mm and larger wafer handling. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.