Machines and apparatus specified in Note 11 (C) to this Chapter
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories. > Machines and apparatus specified in Note 11 (C) to this Chapter > Machines and apparatus specified in Note 11 (C) to this Chapter > Machines and apparatus specified in Note 11 (C) to this Chapter
Duty Rate (from China)
Products classified under Tariff item 8486.40
300mm Wafer Transfer Robot
High-precision robot with dual-arm capability for transferring 300mm silicon wafers between cluster tools in semiconductor fabrication facilities. It integrates with an Equipment Front End Module (EFEM) and is dedicated to wafer handling, which is a function specified in Note 11 (C) (iii) to Chapter 84.
8486.40.00Binary Mask Etching Equipment
> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.
8486.40.00Chemical Mechanical Wafer Polisher
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
8486.40.00Chip Mounter for IC Assembly Lines
>- A high-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats, with vision-guided placement. It is classified under tariff item 8486.40.00 as machinery for assembling electronic integrated circuits.
8486.40.00Crystal Boule Grinder
> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.
8486.40.00Crystal Boule Lifting Manipulator
Precision manipulator designed for lifting and transferring monocrystalline silicon boules from crystal growers to slicing stations. It handles heavy, fragile semiconductor material and is built specifically for that purpose, falling under Note 11 (C) (iii) of Chapter 84.
8486.40.00Czochralski Crystal Puller
> A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules from molten silicon, which are then sliced into wafers. This apparatus is essential for the initial stage of semiconductor wafer manufacturing. It is classified under tariff item 8486.40.00 as it is a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.
8486.40.00Die Bonder Machine for Semiconductor Assembly
>- A precision machine that picks and places semiconductor dies onto lead frames or substrates using epoxy or eutectic bonding methods. It falls under tariff item 8486.40.00 as it is specifically designed for assembling semiconductor devices.
8486.40.00Double-Sided Wafer Lapper
> A double-sided wafer lapping machine that simultaneously processes both sides of semiconductor wafers to achieve parallelism within 1 micron, using cast iron plates and diamond slurry. This equipment is vital for preparing wafers with precise thickness and flatness for device fabrication. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
8486.40.00E-Beam Mask Inspection System
> A high-resolution electron beam inspection system that detects sub-20nm defects on patterned photomasks, ensuring quality in semiconductor mask manufacturing. This machine is essential for quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Electron Beam Mask Writer
> An electron beam mask writer that uses electron beam lithography to directly write patterns onto photomask blanks for semiconductor reticles. This machine is critical for creating high-precision masks. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00EUV Mask Blank Inspection Tool
> A deep ultraviolet inspection system for detecting defects in extreme ultraviolet (EUV) mask blanks before patterning, ensuring blank quality. This machine is essential for advanced semiconductor mask manufacturing. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Flip Chip Bonder for Semiconductor Devices
>- High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. It falls under tariff item 8486.40.00 due to its specialized role in advanced IC packaging processes.
8486.40.00Float Zone Crystal Grower
> A float zone crystal grower that produces monocrystalline semiconductor boules without crucibles, ideal for high-purity silicon and gallium arsenide. This apparatus uses the float zone method to achieve exceptional purity for semiconductor applications. It is classified under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.
8486.40.00FOUP Wafer Unloader Station
Automated station that unloads wafers from FOUP (Front Opening Unified Pod) carriers onto wafer tracks for processing tools. It features nitrogen purge and robotic transfer for contamination control, and is dedicated to semiconductor wafer handling under Note 11 (C) (iii).
8486.40.00Gallium Arsenide Wafer Handler
Specialized handler for compound semiconductor wafers made of gallium arsenide (GaAs) or indium phosphide (InP), used in RF and optoelectronic device production. It addresses the unique fragility of these materials and is dedicated to semiconductor wafer handling under Note 11 (C) (iii).
8486.40.00IC Lead Frame Stripper
>- An automated machine that separates singulated IC packages from continuous lead frames after assembly, featuring vision inspection. It falls under tariff item 8486.40.00 as essential equipment for completing semiconductor device assembly.
8486.40.00Laser Pattern Generator for Reticles
> A high-precision laser-based system that generates intricate patterns on chrome-on-glass reticles used in photolithography. This machine is dedicated to semiconductor mask and reticle manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Mask Alignment Verification System
> A metrology tool that measures overlay accuracy and pattern placement on finished photomasks before lithography use, ensuring mask quality. This machine is essential for manufacturing quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
8486.40.00Mask Pattern Generator Stage
>- An ultra-precise air-bearing XY stage designed specifically for mask writers, providing positioning accuracy below 2 nm. It is a critical component used solely or principally in the manufacture or repair of masks and reticles, which places it under tariff item 8486.40.00 for machines and apparatus specified in Note 11 (C) to Chapter 84.
8486.40.00Mask Reticle Repair Workstation
>- A focused ion beam (FIB) workstation used to repair defects in photomasks and reticles by milling away unwanted material and depositing repair material. Because it is designed solely or principally for the repair of masks and reticles, it is classified under tariff item 8486.40.00.
8486.40.00Multi-Wire Wafer Slicer
> A multi-wire wafer slicer that uses diamond wire to simultaneously cut hundreds of wafers from semiconductor boules, minimizing kerf loss and enabling thin wafer production. This machine is essential for efficient wafer manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, specifically for wafer slicing as per Note 11(C) to Chapter 84.
8486.40.00OPC Mask Verification Station
>- An automated station that verifies optical proximity correction (OPC) patterns on advanced photomasks using aerial image measurement simulation (AIMS). It is a validation tool essential to mask manufacturing, and therefore falls under tariff item 8486.40.00 for machines specified in Note 11 (C).
8486.40.00Phase Shift Mask Writer
>- A specialized stepper that creates phase shift masks with precise thickness control for advanced lithography. As dedicated equipment for manufacturing masks and reticles, it is classified under tariff item 8486.40.00.
8486.40.00Photomask Pellicle Inspection System
>- An automated inspection system that verifies pellicle mounting quality and detects particle contamination on photomasks. Because it is essential apparatus for mask manufacturing and quality control, it falls under tariff item 8486.40.00.
8486.40.00Reticle Handling Trolley
Specialized trolley for transporting and loading photomasks or reticles used in semiconductor lithography. It features vibration isolation and cleanroom wheels, and is designed for the handling of masks and reticles, which is a function specified in Note 11 (C) (i).
8486.40.00Reticles Chrome Deposition Chamber
>- A sputtering system that deposits uniform chrome thin films on quartz substrates to produce photomask blanks. This front-end mask manufacturing equipment is classified under tariff item 8486.40.00 as machinery for manufacturing masks and reticles.
8486.40.00Reticles Defect Repair Laser System
>- A laser-based repair station that removes chrome defects and deposits material on reticles using femtosecond pulses. Its specific application to mask and reticle repair qualifies it for tariff item 8486.40.00.
8486.40.00Reticles Handling Automation System
>- A robotic SMIF-compatible pod handling system for clean transfer of photomasks between manufacturing tools. As essential apparatus for the mask manufacturing workflow, it is classified under tariff item 8486.40.00.
8486.40.00Reticles Mask Cleaning Station
>- An automated wet and megasonic cleaning system designed specifically for cleaning photomasks and reticles without damaging patterns. It is classified under tariff item 8486.40.00 as equipment for mask manufacturing preparation processes.
8486.40.00Semiconductor Lid Attacher
>- Precision equipment that applies and seals metal or ceramic lids onto semiconductor packages using thermal compression or epoxy dispense. It is classified under tariff item 8486.40.00 for the final assembly step in electronic integrated circuit manufacturing.
8486.40.00Semiconductor Wafer Cassette Loader
Automated loader for transferring semiconductor wafers between FOUP cassettes and processing tools. It ensures contamination-free loading and unloading in fab environments, and is dedicated to semiconductor wafer handling under Note 11 (C) (iii).
8486.40.00Semiconductor Wafer Slicing Saw
> A high-precision inner-diameter saw that slices ultra-thin wafers (25-775 microns) from monocrystalline semiconductor boules while minimizing subsurface damage. This machine is critical for producing wafers with minimal defects. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
8486.40.00Silicon Ingot Grinder
> A precision grinder for shaping silicon ingots to uniform diameter prior to wafer slicing, with automatic flat generation for orientation. This machine ensures ingots meet exact specifications for downstream processing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as per Note 11(C) to Chapter 84.
8486.40.00Silicon Wafer Handling Robot
Robotic arm system designed specifically for lifting, transferring, and positioning silicon wafers during semiconductor manufacturing. It operates in cleanroom environments to prevent contamination and is dedicated to wafer handling under Note 11 (C) (iii).
8486.40.00Silicon Wafer Vacuum Lifter
Vacuum-based lifting system for vertical transfer of silicon wafers between storage and processing. It uses contactless operation to prevent particle generation, and is dedicated to semiconductor wafer handling under Note 11 (C) (iii).
8486.40.00Tape and Reel Encapsulator for Semiconductors
>- A machine that seals assembled semiconductor devices in embossed carrier tape for automated handling and shipping, featuring cover tape sealing. It is classified under tariff item 8486.40.00 as part of the electronic integrated circuit assembly process.
8486.40.00Wafer Boat Elevator Loader
Vertical elevator system for loading wafer boats or cassettes into diffusion furnaces and vertical ovens. It handles multiple wafers simultaneously in semiconductor processing, and is dedicated to wafer handling under Note 11 (C) (iii).
8486.40.00Wafer Edge Grinder
> A wafer edge grinder that grinds wafer edges to precise chamfer profiles, preventing chipping during handling and processing. This machine is critical for 300mm and larger wafer handling. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
8486.40.00Wire Bonding Machine for IC Packaging
Automated wire bonding machine that attaches gold or copper wires between semiconductor die pads and lead frame fingers using ultrasonic or thermosonic energy. This equipment is used solely or principally in the assembly of semiconductor devices, which places it under tariff item 8486.40.00 as specified in Note 11 (C) to Chapter 84.