OPC Mask Verification Station
>- An automated station that verifies optical proximity correction (OPC) patterns on advanced photomasks using aerial image measurement simulation (AIMS). It is a validation tool essential to mask manufacturing, and therefore falls under tariff item 8486.40.00 for machines specified in Note 11 (C).
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the station is sold as part of a mask manufacturing line
Complete machines for manufacturing masks and reticles are classified here.
If the equipment is a general-purpose optical inspection apparatus
Apparatus for inspecting semiconductor wafers or masks may fall under Chapter 90 if not dedicated to manufacturing.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• >- Clearly document that the station's principal function is verification of masks and reticles, not general optical inspection, to support classification under 8486.40.00
• If the station includes a microscope that could be classified under Chapter 90, emphasize that it is dedicated to mask manufacturing
• Be prepared to demonstrate that the AIMS technology is integral to the mask production process
Related Products under Tariff item 8486.40.00
300mm Wafer Transfer Robot
High-precision robot with dual-arm capability for transferring 300mm silicon wafers between cluster tools in semiconductor fabrication facilities. It integrates with an Equipment Front End Module (EFEM) and is dedicated to wafer handling, which is a function specified in Note 11 (C) (iii) to Chapter 84.
Binary Mask Etching Equipment
> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.
Chemical Mechanical Wafer Polisher
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
Chip Mounter for IC Assembly Lines
>- A high-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats, with vision-guided placement. It is classified under tariff item 8486.40.00 as machinery for assembling electronic integrated circuits.
Crystal Boule Grinder
> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.
Crystal Boule Lifting Manipulator
Precision manipulator designed for lifting and transferring monocrystalline silicon boules from crystal growers to slicing stations. It handles heavy, fragile semiconductor material and is built specifically for that purpose, falling under Note 11 (C) (iii) of Chapter 84.