Laser Pattern Generator for Reticles
> A high-precision laser-based system that generates intricate patterns on chrome-on-glass reticles used in photolithography. This machine is dedicated to semiconductor mask and reticle manufacturing. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
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Import Tips & Compliance
• > Provide CBSA with evidence that the pattern generator is exclusively for reticle manufacturing, including patterning capabilities
• Investigate the Machinery Program for potential duty relief
• Keep technical documentation to support classification and expedite customs processing
Related Products under Tariff item 8486.40.00
Binary Mask Etching Equipment
> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.
Chemical Mechanical Wafer Polisher
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
Crystal Boule Grinder
> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.
Czochralski Crystal Puller
> A Czochralski crystal puller that produces high-purity monocrystalline semiconductor boules from molten silicon, which are then sliced into wafers. This apparatus is essential for the initial stage of semiconductor wafer manufacturing. It is classified under tariff item 8486.40.00 as it is a machine specified in Note 11(C) to Chapter 84, used solely or principally for the manufacture of semiconductor boules.
Double-Sided Wafer Lapper
> A double-sided wafer lapping machine that simultaneously processes both sides of semiconductor wafers to achieve parallelism within 1 micron, using cast iron plates and diamond slurry. This equipment is vital for preparing wafers with precise thickness and flatness for device fabrication. It falls under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of semiconductor wafers, as per Note 11(C) to Chapter 84.
E-Beam Mask Inspection System
> A high-resolution electron beam inspection system that detects sub-20nm defects on patterned photomasks, ensuring quality in semiconductor mask manufacturing. This machine is essential for quality control in mask production. It is classified under tariff item 8486.40.00 as a machine used solely or principally for the manufacture of masks and reticles, as per Note 11(C) to Chapter 84.