Reticles Defect Repair Laser System
>- A laser-based repair station that removes chrome defects and deposits material on reticles using femtosecond pulses. Its specific application to mask and reticle repair qualifies it for tariff item 8486.40.00.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the laser system is also used for repairing semiconductor devices
Machines for manufacturing semiconductor devices are classified in this heading.
If imported as a part or accessory
Parts and accessories for heading 84.86 machines are classified here.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• >- Document that the laser system is specifically designed for reticle repair, not for general laser machining, to avoid classification under other Chapter 84 headings
• If the system includes a laser source that could be classified separately, confirm that the repair function is principal
• Provide the CBSA with technical specifications showing the femtosecond pulse capability is essential to the repair process
Related Products under Tariff item 8486.40.00
300mm Wafer Transfer Robot
High-precision robot with dual-arm capability for transferring 300mm silicon wafers between cluster tools in semiconductor fabrication facilities. It integrates with an Equipment Front End Module (EFEM) and is dedicated to wafer handling, which is a function specified in Note 11 (C) (iii) to Chapter 84.
Binary Mask Etching Equipment
> A reactive ion etching system optimized for pattern transfer in binary photomask production, essential for creating precise mask patterns. This machine is used solely or principally for the manufacture of masks and reticles for semiconductor production. It falls under tariff item 8486.40.00 as a machine specified in Note 11(C) to Chapter 84, specifically for mask manufacturing.
Chemical Mechanical Wafer Polisher
> A Chemical Mechanical Wafer Polisher (CMP) that uses a combination of chemical slurry and mechanical action to achieve atomic-level flatness on semiconductor wafer surfaces, with roughness below 0.1 nm RMS. This machine is essential for preparing wafers for subsequent lithography and device fabrication steps. It falls under tariff item 8486.40.00 because it is a machine of a kind used solely or principally for the manufacture of semiconductor devices, specifically for wafer polishing as specified in Note 11(C) to Chapter 84.
Chip Mounter for IC Assembly Lines
>- A high-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats, with vision-guided placement. It is classified under tariff item 8486.40.00 as machinery for assembling electronic integrated circuits.
Crystal Boule Grinder
> A precision grinder designed to shape semiconductor crystal boules to exact diameters (e.g., 200mm, 300mm) and to grind orientation flats that indicate conductivity type. This machine is critical for preparing boules for wafer slicing. It is classified under tariff item 8486.40.00 as it is a machine of a kind used solely or principally for the manufacture of semiconductor wafers, specifically for boule grinding as noted in Note 11(C) to Chapter 84.
Crystal Boule Lifting Manipulator
Precision manipulator designed for lifting and transferring monocrystalline silicon boules from crystal growers to slicing stations. It handles heavy, fragile semiconductor material and is built specifically for that purpose, falling under Note 11 (C) (iii) of Chapter 84.