FPD Sputtering Target Deposition System
A magnetron sputtering system that deposits conductive and insulating films, such as indium tin oxide (ITO), onto large flat panel display substrates. It handles Gen 8+ substrates and is a principal apparatus for layer formation in FPD manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
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No agency flag on this HTS number in the CBSA Single Window matching criteria.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the sputtering system is designed for semiconductor wafer processing
Machines for semiconductor manufacture are classified separately under the same heading.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm the system is designed for FPD substrate sizes, not semiconductor wafers, to avoid classification under 8486.20.00
• Provide substrate size specifications in your import documents
• Check if the sputtering targets require separate classification
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