FPD Sputtering Target Deposition System from United States
A magnetron sputtering system that deposits conductive and insulating films, such as indium tin oxide (ITO), onto large flat panel display substrates. It handles Gen 8+ substrates and is a principal apparatus for layer formation in FPD manufacturing.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm the system is designed for FPD substrate sizes, not semiconductor wafers, to avoid classification under 8486.20.00
• Provide substrate size specifications in your import documents
• Check if the sputtering targets require separate classification