Wafer Lapping Machine
Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. This preparation is essential for ensuring the quality of wafers used in integrated circuits. Lapping machines are used in semiconductor device manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the lapping machine is used for processing wafers before device fabrication
Machines for manufacturing semiconductor wafers are classified under 8486.10.00.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm the lapping machine is used for semiconductor wafer processing to qualify under 8486.20.00
• Provide technical specifications showing its role in wafer preparation
• Verify if the machine uses any abrasive materials that may require special import documentation
Related Products under Tariff item 8486.20.00
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Chemical mechanical polishing (CMP) tools polish semiconductor wafers to atomic-level flatness using a combination of chemical slurry and mechanical pads. This process is critical for planarizing layers during integrated circuit fabrication, ensuring subsequent lithography and etching steps are accurate. CMP tools are essential for semiconductor device manufacturing, falling under this tariff item.
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