Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this Chapter; parts and accessories. > Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits > Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits
Duty Rate (from China)
Products classified under Tariff item 8486.20
Chemical Mechanical Wafer Polisher
Chemical mechanical polishing (CMP) tools polish semiconductor wafers to atomic-level flatness using a combination of chemical slurry and mechanical pads. This process is critical for planarizing layers during integrated circuit fabrication, ensuring subsequent lithography and etching steps are accurate. CMP tools are essential for semiconductor device manufacturing, falling under this tariff item.
8486.20.00Chemical Vapor Deposition Furnace
Chemical vapor deposition (CVD) furnaces deposit thin films of insulators, metals, or semiconductors onto wafers through gas-phase chemical reactions. These films are essential for creating the layers of integrated circuits, providing conformal coatings with precise thickness control. CVD furnaces are a core piece of equipment in semiconductor device manufacturing.
8486.20.00Crystal Boule Grinder
Crystal boule grinders shape semiconductor boules to precise diameters and grind flats that indicate conductivity type and resistivity. This preparation step is essential before slicing the boule into wafers for semiconductor device manufacturing. The grinder is a machine used solely or principally for the manufacture of semiconductor boules.
8486.20.00Czochralski Crystal Puller
A Czochralski crystal puller produces extremely pure monocrystalline silicon boules by pulling a seed crystal from molten silicon. These boules are the starting material for semiconductor wafers used in electronic integrated circuits. The puller is a machine used solely or principally for the manufacture of semiconductor boules.
8486.20.00Dielectric Film Sputtering System
Dielectric film sputtering systems use plasma sputtering to deposit thin dielectric and metal films onto semiconductor wafers. These films are crucial for creating insulating and conductive layers in integrated circuits. Sputtering systems are essential for semiconductor device manufacturing, providing pinhole-free films with precise thickness.
8486.20.00Float Zone Crystal Grower
Float zone crystal growers produce monocrystalline semiconductor boules using the float zone method, which is ideal for high-purity silicon wafers. This method is used for applications requiring extremely low impurity levels in electronic integrated circuits. The grower is a machine used solely or principally for the manufacture of semiconductor boules.
8486.20.00Ion Implantation System
High-energy ion implanters dope semiconductor wafers with precise impurity concentrations to form transistors and other structures in integrated circuits. This process controls dopant depth and profile, which is critical for device performance. Ion implantation systems are essential for semiconductor device manufacturing.
8486.20.00Photolithography Wafer Stepper
Photolithography wafer steppers expose circuit patterns onto photoresist-coated semiconductor wafers using projection optics. This process is fundamental to defining the microscopic features of integrated circuits. Wafer steppers are a core piece of equipment in semiconductor device manufacturing.
8486.20.00Plasma Etching Reactor
Plasma etching reactors use reactive ion etching to anisotropically remove material from semiconductor wafers, defining circuit patterns with high precision. This process is essential for creating the intricate structures of integrated circuits. Plasma etching reactors are core semiconductor device processing apparatus.
8486.20.00Semiconductor Wafer Metrology Tool
In-line metrology tools measure wafer thickness, overlay, and critical dimensions during semiconductor device manufacturing for process control. These tools are integral to ensuring the quality and yield of integrated circuits. Metrology tools used in the fabrication process are classified under this tariff item.
8486.20.00Semiconductor Wafer Slicing Saw
Wafer slicing saws precisely cut monocrystalline semiconductor boules into thin wafers for device fabrication, using diamond wire or blades. This step is essential for producing the wafers that will undergo semiconductor device manufacturing. The saw is a machine used solely or principally for the manufacture of semiconductor wafers.
8486.20.00Silicon Wafer Cleaning Station
Automated cleaning stations remove particles and contaminants from semiconductor wafers using megasonic, brush, or chemical methods before processing. This cleaning is essential for maintaining the purity and quality of wafers during integrated circuit fabrication. Cleaning stations are used in semiconductor device manufacturing.
8486.20.00Wafer Annealing Oven
Rapid thermal annealing ovens activate dopants and repair lattice damage in semiconductor wafers after ion implantation. This process is critical for ensuring the electrical properties of integrated circuits. Wafer annealing ovens are used in semiconductor device manufacturing.
8486.20.00Wafer Edge Grinding Machine
Wafer edge grinding machines profile the edges of semiconductor wafers to prevent chipping and ensure safe handling during fabrication. This edge profiling is essential for maintaining wafer integrity throughout the manufacturing process. Edge grinding machines are used in semiconductor device manufacturing.
8486.20.00Wafer Lapping Machine
Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. This preparation is essential for ensuring the quality of wafers used in integrated circuits. Lapping machines are used in semiconductor device manufacturing.