Semiconductor Wafer Slicing Saw
Wafer slicing saws precisely cut monocrystalline semiconductor boules into thin wafers for device fabrication, using diamond wire or blades. This step is essential for producing the wafers that will undergo semiconductor device manufacturing. The saw is a machine used solely or principally for the manufacture of semiconductor wafers.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the slicing saw is used for cutting boules into wafers before device fabrication
Machines for manufacturing semiconductor wafers are classified under 8486.10.00.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm the slicing saw is used for cutting semiconductor boules into wafers to qualify under 8486.20.00
• Provide technical specifications showing its role in wafer production
• Ensure compliance with Canadian safety standards for machinery with moving parts
Related Products under Tariff item 8486.20.00
Chemical Mechanical Wafer Polisher
Chemical mechanical polishing (CMP) tools polish semiconductor wafers to atomic-level flatness using a combination of chemical slurry and mechanical pads. This process is critical for planarizing layers during integrated circuit fabrication, ensuring subsequent lithography and etching steps are accurate. CMP tools are essential for semiconductor device manufacturing, falling under this tariff item.
Chemical Vapor Deposition Furnace
Chemical vapor deposition (CVD) furnaces deposit thin films of insulators, metals, or semiconductors onto wafers through gas-phase chemical reactions. These films are essential for creating the layers of integrated circuits, providing conformal coatings with precise thickness control. CVD furnaces are a core piece of equipment in semiconductor device manufacturing.
Crystal Boule Grinder
Crystal boule grinders shape semiconductor boules to precise diameters and grind flats that indicate conductivity type and resistivity. This preparation step is essential before slicing the boule into wafers for semiconductor device manufacturing. The grinder is a machine used solely or principally for the manufacture of semiconductor boules.
Czochralski Crystal Puller
A Czochralski crystal puller produces extremely pure monocrystalline silicon boules by pulling a seed crystal from molten silicon. These boules are the starting material for semiconductor wafers used in electronic integrated circuits. The puller is a machine used solely or principally for the manufacture of semiconductor boules.
Dielectric Film Sputtering System
Dielectric film sputtering systems use plasma sputtering to deposit thin dielectric and metal films onto semiconductor wafers. These films are crucial for creating insulating and conductive layers in integrated circuits. Sputtering systems are essential for semiconductor device manufacturing, providing pinhole-free films with precise thickness.
Float Zone Crystal Grower
Float zone crystal growers produce monocrystalline semiconductor boules using the float zone method, which is ideal for high-purity silicon wafers. This method is used for applications requiring extremely low impurity levels in electronic integrated circuits. The grower is a machine used solely or principally for the manufacture of semiconductor boules.