Chemical Mechanical Wafer Polisher
CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily chemical processing equipment
Centrifuges/reactors without mechanical removal classify as chemical plant machinery.
If for thermal-chemical wafer processing
Pure thermal semiconductor machines exclude mechanical polishing.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Detail slurry and platen RPM specs to distinguish from pure chemical processors
• Obtain advance classification ruling for hybrid CMP systems
Related Products under HTS 8461.90.60
Multi-Wire Wafer Saw
Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.
Stress Relief Wafer Grinder
Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.
Wafer Surface Lapper
Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.
Diamond Wafer Polishing Machine
Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).
Crystal Ingot Notcher
Machine that notches silicon ingots to precise flats indicating crystal orientation and doping. Performs slotting/planing operations removing material, thus HTS 8461.90.60 for semiconductor boule preparation.
Czochralski Crystal Puller
A machine tool used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski method. It removes excess material through precise shaping and grinding processes to achieve the required boule diameter and flats, classifying it under HTS 8461.90.60 as other semiconductor manufacturing equipment involving metal/cermet removal.