Chemical Mechanical Wafer Polisher from Germany
CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail slurry and platen RPM specs to distinguish from pure chemical processors
• Obtain advance classification ruling for hybrid CMP systems