Other
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Subheadings
Products classified under HTS 8461.90.60
Multi-Wire Wafer Saw
Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.
Stress Relief Wafer Grinder
Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.
Wafer Surface Lapper
Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.
Diamond Wafer Polishing Machine
Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).
Crystal Ingot Notcher
Machine that notches silicon ingots to precise flats indicating crystal orientation and doping. Performs slotting/planing operations removing material, thus HTS 8461.90.60 for semiconductor boule preparation.
Czochralski Crystal Puller
A machine tool used to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski method. It removes excess material through precise shaping and grinding processes to achieve the required boule diameter and flats, classifying it under HTS 8461.90.60 as other semiconductor manufacturing equipment involving metal/cermet removal.
Float Zone Crystal Grower
Equipment employing the float zone method to produce high-purity silicon crystals by zone melting and shaping. It integrates sawing and grinding to slice and finish boules into wafer-ready forms, falling under HTS 8461.90.60 for other machine tools removing metal in semiconductor processing.
Crystal Boule Grinder
Precision grinder that shapes silicon crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. As wafer preparation equipment removing cermet material, it is classified in HTS 8461.90.60 under other machine tools for semiconductor manufacturing.
Semiconductor Wafer Slicing Saw
High-precision diamond saw that slices monocrystalline boules into thin semiconductor wafers. Working by removing material through sawing, it matches HTS 8461.90.60 for other machine tools in wafer manufacturing per statistical note (a)(ii)(B).
Wafer Edge Grinder
Machine that grinds the edges of sliced semiconductor wafers to precise dimensions and removes damage from sawing. Classified under HTS 8461.90.60 as other wafer preparation equipment involving cermet material removal.
Wafer Lapping Machine
Double-sided lapping equipment that abrades both surfaces of semiconductor wafers to achieve flatness tolerances critical for fabrication. Falls under HTS 8461.90.60 per statistical note (a)(ii)(C) for wafer preparation by material removal.
Chemical Mechanical Wafer Polisher
CMP tool that chemically and mechanically polishes wafer surfaces to atomic flatness for device fabrication. The mechanical platen removes cermet material, classifying under HTS 8461.90.60 as other semiconductor processing machine tool.
Silicon Wafer Back Grinder
Precision grinder that thins silicon wafers from the backside to target thickness (e.g., 50-100 microns) for advanced packaging. HTS 8461.90.60 applies as wafer preparation equipment removing semiconductor cermet material.
Gallium Arsenide Wafer Slicer
Specialized saw for slicing compound semiconductor (GaAs) boules into wafers, using fine kerf wire saw technology. Covered by HTS 8461.90.60 statistical note for semiconductor wafer manufacturing equipment.
Epitaxy Wafer Preparation Polisher
Final polish station creating ultra-flat wafer surfaces (<0.5 micron total thickness variation) for epitaxial layer growth. HTS 8461.90.60 classification for CMP-type wafer polishers in semiconductor manufacturing.