Other
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Other > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.90.60.90
Silicon Wafer Polisher
Double-sided polishing machine bringing semiconductor wafers to final thickness and mirror finish before device fabrication. Falls under HTS 8461.90.60.90 as other machine tool for cermet surface finishing.
Crystal Annealing Furnace Shaper
Integrated shaping station within high-temperature annealing furnaces maintaining crystal integrity during thermal processing. Falls under HTS 8461.90.60.90 as combined machine tool.
Automated Wafer Backlapper
Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.
Large Diameter Ingot Trimmer
Heavy-duty trim saw/grinder for 450mm+ semiconductor ingots preparing for next-gen wafer production. HTS 8461.90.60.90 other large-scale cermet working tools.
Czochralski Crystal Puller
A machine tool used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It falls under HTS 8461.90.60.90 as specialized equipment for shaping semiconductor crystal ingots through controlled pulling and rotation, classified among other metal-removal machine tools not elsewhere specified.
Float Zone Crystal Grower
Equipment employing the float zone method to grow high-purity silicon crystals by melting a narrow zone of polycrystalline rod without a crucible. Classified in HTS 8461.90.60.90 as other machine tools for precise shaping of semiconductor materials through zone refining and pulling.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. Under HTS 8461.90.60.90 as other machine tools removing material from cermet-like semiconductor crystals.
Semiconductor Wafer Slicing Saw
Diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8461.90.60.90 covers this as other sawing machine tools for precise cermet material removal in semiconductor processing.
Wafer Edge Grinder
Machine that grinds wafer edges to prevent chipping and achieve precise roundness for subsequent fabrication steps. Classified HTS 8461.90.60.90 as specialized shaping tool removing minimal semiconductor material.
Crystal Ingot Lapping Machine
Lapping equipment that achieves flatness on crystal ingots prior to slicing, using diamond slurries for sub-micron surface finish. HTS 8461.90.60.90 as other finishing machine tool for semiconductor boule preparation.
Gallium Arsenide Boule Shaper
Specialized shaping machine for compound semiconductor boules like GaAs, featuring corrosion-resistant tooling for precise diameter control. HTS 8461.90.60.90 other machine tools working compound cermets.
Wafer Thickness Grinder
Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.
SiC Wafer Lapper
Lapping system for hard silicon carbide wafers using diamond abrasives to achieve extreme flatness for power electronics. HTS 8461.90.60.90 as other machine tool for difficult cermets.
Diamond Wire Wafer Saw
Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon boules. HTS 8461.90.60.90 other high-precision sawing for semiconductors.
Compound Semiconductor Profile Grinder
Grinder for creating specific flat orientations on GaN, InP boules for LED/photonics applications with crystal orientation accuracy. HTS 8461.90.60.90 other precision shaping.