Wafer Thickness Grinder
Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If wafer grinder per statistical notes
All semiconductor wafer grinders directed to 8486.
If industrial wafer thinning applications
General grinding when not semiconductor production-specific.
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Import Tips & Compliance
• Specify TTV specs and temporary bond/debond compatibility
• Stress relief process documentation critical for classification
Related Products under HTS 8461.90.60.90
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Double-sided polishing machine bringing semiconductor wafers to final thickness and mirror finish before device fabrication. Falls under HTS 8461.90.60.90 as other machine tool for cermet surface finishing.
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Integrated shaping station within high-temperature annealing furnaces maintaining crystal integrity during thermal processing. Falls under HTS 8461.90.60.90 as combined machine tool.
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Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.
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Heavy-duty trim saw/grinder for 450mm+ semiconductor ingots preparing for next-gen wafer production. HTS 8461.90.60.90 other large-scale cermet working tools.
Czochralski Crystal Puller
A machine tool used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process. It falls under HTS 8461.90.60.90 as specialized equipment for shaping semiconductor crystal ingots through controlled pulling and rotation, classified among other metal-removal machine tools not elsewhere specified.
Float Zone Crystal Grower
Equipment employing the float zone method to grow high-purity silicon crystals by melting a narrow zone of polycrystalline rod without a crucible. Classified in HTS 8461.90.60.90 as other machine tools for precise shaping of semiconductor materials through zone refining and pulling.