</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.90.60.90/Wafer Thickness Grinder/Canada

Wafer Thickness Grinder from Canada

Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify TTV specs and temporary bond/debond compatibility

• Stress relief process documentation critical for classification

Wafer Thickness Grinder from Canada — Import Duty Rate | HTS 8461.90.60.90