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8461.90.60.90/Wafer Thickness Grinder/Canada

Wafer Thickness Grinder from Canada

Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Specify TTV specs and temporary bond/debond compatibility

• Stress relief process documentation critical for classification

Wafer Thickness Grinder from Canada — Import Duty Rate | HTS 8461.90.60.90