</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.90.60.90/Wafer Thickness Grinder/Japan

Wafer Thickness Grinder from Japan

Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify TTV specs and temporary bond/debond compatibility

• Stress relief process documentation critical for classification

Wafer Thickness Grinder from Japan — Import Duty Rate | HTS 8461.90.60.90