Wafer Thickness Grinder from Japan
Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify TTV specs and temporary bond/debond compatibility
• Stress relief process documentation critical for classification