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8461.90.60.90/Wafer Thickness Grinder/Mexico

Wafer Thickness Grinder from Mexico

Backside grinder reducing wafer thickness from ~500μm to 50-100μm while maintaining TTV <1μm for advanced packaging. Classified HTS 8461.90.60.90 specialized semiconductor thinning equipment.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify TTV specs and temporary bond/debond compatibility

• Stress relief process documentation critical for classification

Wafer Thickness Grinder from Mexico — Import Duty Rate | HTS 8461.90.60.90