Silicon Wafer Back Grinder
Precision grinder that thins silicon wafers from the backside to target thickness (e.g., 50-100 microns) for advanced packaging. HTS 8461.90.60 applies as wafer preparation equipment removing semiconductor cermet material.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general surface grinding to shape
Other grinding machines not dedicated to semiconductor wafers.
If sold as complete wafer processing line machine
Integrated systems may fall under machines NESOI for semiconductor use.
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Import Tips & Compliance
• Specify minimum achievable thickness in technical literature submitted
• Classify tape frames separately if imported together
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