Silicon Wafer Back Grinder from Canada
Precision grinder that thins silicon wafers from the backside to target thickness (e.g., 50-100 microns) for advanced packaging. HTS 8461.90.60 applies as wafer preparation equipment removing semiconductor cermet material.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify minimum achievable thickness in technical literature submitted
• Classify tape frames separately if imported together