8461.90.60/Silicon Wafer Back Grinder/Germany

Silicon Wafer Back Grinder from Germany

Precision grinder that thins silicon wafers from the backside to target thickness (e.g., 50-100 microns) for advanced packaging. HTS 8461.90.60 applies as wafer preparation equipment removing semiconductor cermet material.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Specify minimum achievable thickness in technical literature submitted

• Classify tape frames separately if imported together