Other
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Other > Planing machines: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.90.60.30
Wafer Surface Planer for Float Zone Silicon
Precision planer specifically engineered for float zone silicon wafers, removing material to achieve mirror-flat surfaces prior to fabrication. HTS 8461.90.60.30 classification applies due to its planing action on cermet-like semiconductor materials as defined in Chapter 84 statistical notes for wafer preparation.
CNC Planing Machine for Semiconductor Wafer Preparation
A precision CNC-controlled planing machine designed to plane the surface of semiconductor crystal boules or wafers to exact flatness tolerances required for subsequent fabrication processes. Classified under HTS 8461.90.60.30 as a planing machine working by removing metal or cermets (silicon being a metalloid processed similarly), specifically for high-precision semiconductor manufacturing applications. It features vacuum chucks and specialized tooling for handling fragile silicon substrates.
Crystal Boule Planer Grinder
Heavy-duty planer grinder used to achieve precise diameter and flatness on monocrystalline silicon boules before wafer slicing, employing Czochralski-grown crystals. Falls under HTS 8461.90.60.30 as specialized planing equipment removing silicon (cermet-like material) in semiconductor manufacturing. Includes diamond tooling and metrology feedback systems for sub-micron accuracy.
Automated Silicon Ingot Planing Station
Fully automated station combining planing heads for silicon ingot diameter control and flat grinding, integral to semiconductor boule preparation workflow. Classified in 8461.90.60.30 as 'other planing machines' specifically removing semiconductor cermets per statistical definitions.
Precision Boule Flattening Planer
Machine tool that planes reference flats on semiconductor boules to indicate conductivity type and resistivity, critical for wafer identification. HTS 8461.90.60.30 covers this as planing equipment for cermet semiconductor materials per Chapter 84 notes.