Used or rebuilt
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Other > Other: > Used or rebuilt
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.90.60.40
Used Semiconductor Crystal Shaper
Reconditioned shaping machine for custom crystal geometries in compound semiconductor production. HTS 8461.90.60.40 for used shaping tools working cermets.
Rebuilt Cermet Gear Finishing Machine
Refurbished machine for final gear finishing on cermet components used in semiconductor handlers. Classified HTS 8461.90.60.40 for rebuilt gear finishing tools.
Used boule Diameter Grinder
Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.
Rebuilt Semiconductor Broaching Machine
Refurbished broaching tool for creating precise keyways in semiconductor equipment components. Falls under HTS 8461.90.60.40 as rebuilt broaching machine tool.
Used Wafer Slotting Saw
Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.
Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.
Rebuilt Float Zone Crystal Grower
A used float zone furnace rebuilt for producing high-purity silicon crystals by zone melting and metal removal via grinding electrodes. Classified under HTS 8461.90.60.40 for its metal-removing functions in semiconductor boule shaping and finishing. Essential for oxygen-free semiconductor wafers.
Used Crystal Boule Grinder
Reconditioned grinding machine that shapes semiconductor crystal boules to exact diameters and flats indicating conductivity type. HTS 8461.90.60.40 applies as a used metal-removal tool for cermet/semiconductor material preparation per statistical notes.
Rebuilt Wafer Slicing Diamond Saw
Refurbished inner-diameter saw with diamond blade for precision slicing of semiconductor wafers from silicon boules. Falls under HTS 8461.90.60.40 as rebuilt sawing machine removing metal/cermets in semiconductor processing.
Used Wafer Edge Grinder
Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.
Rebuilt Semiconductor Wafer Lapper
Refurbished lapping machine that achieves flatness tolerances on wafer surfaces for device fabrication. Classified HTS 8461.90.60.40 as rebuilt metal/cermet removal tool per statistical notes.
Used Crystal boule Slicer
Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.
Rebuilt Wafer Back Grinder
Refurbished machine grinding the backside of thinned wafers to exact thickness specifications. Falls under HTS 8461.90.60.40 as used grinding tool for semiconductor wafer processing.
Used Semiconductor Gear Hobber
Rebuilt hobbing machine adapted for precision gear cutting in semiconductor equipment drives. HTS 8461.90.60.40 for used gear cutting tools not elsewhere specified.
Rebuilt Wafer Polishing Machine
Refurbished chemical-mechanical polisher (CMP) for final wafer surface preparation. Classified under HTS 8461.90.60.40 as rebuilt machine removing cermets via polishing action.