Used Crystal boule Slicer
Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If boule slicing as wafer manufacturing equipment
Statistical notes cover boule slicing saws.
If not specifically rebuilt but used sawing machine
Sawing or cut-off machines have dedicated subheading.
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Import Tips & Compliance
• Specify coolant system and blade tensioning for precision cuts
• Provide evidence of semiconductor material compatibility
• Include safety interlock certifications
Related Products under HTS 8461.90.60.40
Used Semiconductor Crystal Shaper
Reconditioned shaping machine for custom crystal geometries in compound semiconductor production. HTS 8461.90.60.40 for used shaping tools working cermets.
Rebuilt Cermet Gear Finishing Machine
Refurbished machine for final gear finishing on cermet components used in semiconductor handlers. Classified HTS 8461.90.60.40 for rebuilt gear finishing tools.
Used boule Diameter Grinder
Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.
Rebuilt Semiconductor Broaching Machine
Refurbished broaching tool for creating precise keyways in semiconductor equipment components. Falls under HTS 8461.90.60.40 as rebuilt broaching machine tool.
Used Wafer Slotting Saw
Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.
Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.