Used Crystal boule Slicer from Mexico
Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify coolant system and blade tensioning for precision cuts
• Provide evidence of semiconductor material compatibility
• Include safety interlock certifications