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Used Crystal boule Slicer from Mexico

Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Specify coolant system and blade tensioning for precision cuts

Provide evidence of semiconductor material compatibility

Include safety interlock certifications