Used Crystal boule Slicer from Japan
Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify coolant system and blade tensioning for precision cuts
• Provide evidence of semiconductor material compatibility
• Include safety interlock certifications