8461.90.60.40/Used Crystal boule Slicer/Japan

Used Crystal boule Slicer from Japan

Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify coolant system and blade tensioning for precision cuts

• Provide evidence of semiconductor material compatibility

• Include safety interlock certifications