Numerically controlled
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Sawing or cutting-off machines: > Numerically controlled
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.50.40
K&S 8800 Turbo Wafer Dicing Saw
High-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. Classified in HTS 8461.50.40 for NC sawing machines used in semiconductor device fabrication.
Mazak Optonics HCG-4020 CNC Laser Cutting Machine
A numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules in semiconductor manufacturing. It removes material using a focused laser beam on silicon or gallium arsenide, fitting under HTS 8461.50.40 as a numerically controlled sawing or cutting-off machine working by removing metal or cermets.
DISCO DFD6360 Fully Automatic Dicing Saw
Numerically controlled dicing saw for sawing semiconductor wafers into individual chips by removing material along scribe lines. Used in back-end semiconductor processing, classified under HTS 8461.50.40 for its NC control and precise cutting-off function on cermet-like wafer materials.
ADT 958 Sapphire Wafer Sawing System
CNC-controlled precision saw for cutting-off synthetic sapphire wafers used in LED semiconductor production by removing material with diamond blades. Falls under HTS 8461.50.40 as a numerically controlled sawing machine for cermet materials in semiconductor processing.
Logitech WA/20 Wafer Slicing Machine
Numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. Specifically for crystal growers' output per statistical notes, under HTS 8461.50.40 as NC sawing machine.
Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System
CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. Removes metal/cermet via abrasive wheel, classified under HTS 8461.50.40 for numerically controlled sawing operations.
Sylatronix STX 220 Wafer Dicing Saw
Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.
Loadpoint Micro ACE Stealth Dicing Machine
Ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. Material removal via internal fracture, but structured as NC sawing under HTS 8461.50.40.
ZAX Wafer Edge Profiling Saw
Numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. Essential for semiconductor wafer preparation, HTS 8461.50.40.
ESEC 2100 Wafer Sawing Platform
Modular numerically controlled sawing system for semiconductor wafer cutting-off operations. Configurable for different cermet materials, classified HTS 8461.50.40.