ADT 958 Sapphire Wafer Sawing System
CNC-controlled precision saw for cutting-off synthetic sapphire wafers used in LED semiconductor production by removing material with diamond blades. Falls under HTS 8461.50.40 as a numerically controlled sawing machine for cermet materials in semiconductor processing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.4% | +35.0% | 39.4% |
| 🇲🇽Mexico | 4.4% | +10.0% | 14.4% |
| 🇨🇦Canada | 4.4% | +10.0% | 14.4% |
| 🇩🇪Germany | 4.4% | +10.0% | 14.4% |
| 🇯🇵Japan | 4.4% | +10.0% | 14.4% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If other than sawing/cutting-off function
Non-sawing NC machine tools working by metal removal go to 8461.90.
If for dedicated crystal boule slicing
Wafer preparation equipment like slicing saws may classify under semiconductor machines in 8486.
If imported as saw blade only
Separate circular saw blades are tools under Chapter 82, not machines.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include material compatibility certs (sapphire/cermets) in customs entry
• Avoid generic 'saw' description; specify NC control and semiconductor end-use
• Document blade specs to prove metal/cermet removal process
Related Products under HTS 8461.50.40
K&S 8800 Turbo Wafer Dicing Saw
High-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. Classified in HTS 8461.50.40 for NC sawing machines used in semiconductor device fabrication.
Mazak Optonics HCG-4020 CNC Laser Cutting Machine
A numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules in semiconductor manufacturing. It removes material using a focused laser beam on silicon or gallium arsenide, fitting under HTS 8461.50.40 as a numerically controlled sawing or cutting-off machine working by removing metal or cermets.
DISCO DFD6360 Fully Automatic Dicing Saw
Numerically controlled dicing saw for sawing semiconductor wafers into individual chips by removing material along scribe lines. Used in back-end semiconductor processing, classified under HTS 8461.50.40 for its NC control and precise cutting-off function on cermet-like wafer materials.
Logitech WA/20 Wafer Slicing Machine
Numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. Specifically for crystal growers' output per statistical notes, under HTS 8461.50.40 as NC sawing machine.
Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System
CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. Removes metal/cermet via abrasive wheel, classified under HTS 8461.50.40 for numerically controlled sawing operations.
Sylatronix STX 220 Wafer Dicing Saw
Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.