ADT 958 Sapphire Wafer Sawing System from China
CNC-controlled precision saw for cutting-off synthetic sapphire wafers used in LED semiconductor production by removing material with diamond blades. Falls under HTS 8461.50.40 as a numerically controlled sawing machine for cermet materials in semiconductor processing.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include material compatibility certs (sapphire/cermets) in customs entry
• Avoid generic 'saw' description; specify NC control and semiconductor end-use
• Document blade specs to prove metal/cermet removal process