ADT 958 Sapphire Wafer Sawing System from Germany
CNC-controlled precision saw for cutting-off synthetic sapphire wafers used in LED semiconductor production by removing material with diamond blades. Falls under HTS 8461.50.40 as a numerically controlled sawing machine for cermet materials in semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include material compatibility certs (sapphire/cermets) in customs entry
• Avoid generic 'saw' description; specify NC control and semiconductor end-use
• Document blade specs to prove metal/cermet removal process