ADT 958 Sapphire Wafer Sawing System from Germany
CNC-controlled precision saw for cutting-off synthetic sapphire wafers used in LED semiconductor production by removing material with diamond blades. Falls under HTS 8461.50.40 as a numerically controlled sawing machine for cermet materials in semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include material compatibility certs (sapphire/cermets) in customs entry
• Avoid generic 'saw' description; specify NC control and semiconductor end-use
• Document blade specs to prove metal/cermet removal process