ADT 958 Sapphire Wafer Sawing System from Canada
CNC-controlled precision saw for cutting-off synthetic sapphire wafers used in LED semiconductor production by removing material with diamond blades. Falls under HTS 8461.50.40 as a numerically controlled sawing machine for cermet materials in semiconductor processing.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include material compatibility certs (sapphire/cermets) in customs entry
• Avoid generic 'saw' description; specify NC control and semiconductor end-use
• Document blade specs to prove metal/cermet removal process