Used Crystal boule Slicer from Germany
Reconditioned bandsaw-style machine for initial rough slicing of semiconductor boules into blocks. HTS 8461.90.60.40 covers used sawing tools for cermet/metal removal in wafer production.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify coolant system and blade tensioning for precision cuts
• Provide evidence of semiconductor material compatibility
• Include safety interlock certifications