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Used Wafer Slotting Saw

Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+37.5%41.9%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8461.20.80Same rate: 41.9%

If general slotting/shaping machines

May classify under shaping if not semiconductor-specific.

8486.40.00Lower: 25% vs 41.9%

If as part of wafer metrology equipment

Alignment equipment often in semiconductor chapter.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Specify notch geometry and fiducial mark accuracy

• Provide laser alignment system calibration

• Document wafer handling automation interface

Related Products under HTS 8461.90.60.40

Used Semiconductor Crystal Shaper

Reconditioned shaping machine for custom crystal geometries in compound semiconductor production. HTS 8461.90.60.40 for used shaping tools working cermets.

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Refurbished machine for final gear finishing on cermet components used in semiconductor handlers. Classified HTS 8461.90.60.40 for rebuilt gear finishing tools.

Used boule Diameter Grinder

Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.

Rebuilt Semiconductor Broaching Machine

Refurbished broaching tool for creating precise keyways in semiconductor equipment components. Falls under HTS 8461.90.60.40 as rebuilt broaching machine tool.

Used Czochralski Crystal Puller

A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.

Rebuilt Float Zone Crystal Grower

A used float zone furnace rebuilt for producing high-purity silicon crystals by zone melting and metal removal via grinding electrodes. Classified under HTS 8461.90.60.40 for its metal-removing functions in semiconductor boule shaping and finishing. Essential for oxygen-free semiconductor wafers.