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Used Wafer Slotting Saw from Japan

Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Specify notch geometry and fiducial mark accuracy

Provide laser alignment system calibration

Document wafer handling automation interface