Rebuilt Wafer Back Grinder
Refurbished machine grinding the backside of thinned wafers to exact thickness specifications. Falls under HTS 8461.90.60.40 as used grinding tool for semiconductor wafer processing.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If part of complete wafer testing/thinning station
Semiconductor testing machines may encompass grinding functions.
If sharpening/precision grinding machines
Alternative for high-precision semiconductor grinders.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Document thickness control to ±1 micron accuracy
• Verify vacuum chuck flatness specifications
• Include particle monitoring system details
Related Products under HTS 8461.90.60.40
Used Semiconductor Crystal Shaper
Reconditioned shaping machine for custom crystal geometries in compound semiconductor production. HTS 8461.90.60.40 for used shaping tools working cermets.
Rebuilt Cermet Gear Finishing Machine
Refurbished machine for final gear finishing on cermet components used in semiconductor handlers. Classified HTS 8461.90.60.40 for rebuilt gear finishing tools.
Used boule Diameter Grinder
Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.
Rebuilt Semiconductor Broaching Machine
Refurbished broaching tool for creating precise keyways in semiconductor equipment components. Falls under HTS 8461.90.60.40 as rebuilt broaching machine tool.
Used Wafer Slotting Saw
Rebuilt precision saw for creating alignment slots/notches on semiconductor wafers. HTS 8461.90.60.40 covers used slotting machine tools.
Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.