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8461.90.60.40/Rebuilt Wafer Back Grinder/Canada

Rebuilt Wafer Back Grinder from Canada

Refurbished machine grinding the backside of thinned wafers to exact thickness specifications. Falls under HTS 8461.90.60.40 as used grinding tool for semiconductor wafer processing.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Document thickness control to ±1 micron accuracy

• Verify vacuum chuck flatness specifications

• Include particle monitoring system details

Rebuilt Wafer Back Grinder from Canada — Import Duty Rate | HTS 8461.90.60.40