8461.90.60.40/Rebuilt Wafer Back Grinder/Japan

Rebuilt Wafer Back Grinder from Japan

Refurbished machine grinding the backside of thinned wafers to exact thickness specifications. Falls under HTS 8461.90.60.40 as used grinding tool for semiconductor wafer processing.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Calculate with your customs value Verify classification with AI

Import Tips

• Document thickness control to ±1 micron accuracy

• Verify vacuum chuck flatness specifications

• Include particle monitoring system details