Rebuilt Wafer Back Grinder from Japan
Refurbished machine grinding the backside of thinned wafers to exact thickness specifications. Falls under HTS 8461.90.60.40 as used grinding tool for semiconductor wafer processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document thickness control to ±1 micron accuracy
• Verify vacuum chuck flatness specifications
• Include particle monitoring system details