8461.90.60.40/Rebuilt Wafer Back Grinder/Japan

Rebuilt Wafer Back Grinder from Japan

Refurbished machine grinding the backside of thinned wafers to exact thickness specifications. Falls under HTS 8461.90.60.40 as used grinding tool for semiconductor wafer processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document thickness control to ±1 micron accuracy

• Verify vacuum chuck flatness specifications

• Include particle monitoring system details