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Rebuilt Wafer Slicing Diamond Saw

Refurbished inner-diameter saw with diamond blade for precision slicing of semiconductor wafers from silicon boules. Falls under HTS 8461.90.60.40 as rebuilt sawing machine removing metal/cermets in semiconductor processing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+37.5%41.9%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.29.01Same rate: 41.9%

If as wafer preparation slicing equipment

Explicitly listed in statistical notes for semiconductor wafer saws.

8202.39.00Lower: 37.5% vs 41.9%

If imported as replacement saw blade only

Bandsaw blades separate from machine classify as metalworking tools.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Certify diamond blade thickness and kerf specs for wafer tolerance compliance

• Provide slicing test data showing sub-micron accuracy

• Declare as semiconductor-specific to avoid general saw classification