Rebuilt Wafer Slicing Diamond Saw
Refurbished inner-diameter saw with diamond blade for precision slicing of semiconductor wafers from silicon boules. Falls under HTS 8461.90.60.40 as rebuilt sawing machine removing metal/cermets in semiconductor processing.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If as wafer preparation slicing equipment
Explicitly listed in statistical notes for semiconductor wafer saws.
If imported as replacement saw blade only
Bandsaw blades separate from machine classify as metalworking tools.
Not sure which classification is right?
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Import Tips & Compliance
• Certify diamond blade thickness and kerf specs for wafer tolerance compliance
• Provide slicing test data showing sub-micron accuracy
• Declare as semiconductor-specific to avoid general saw classification
Related Products under HTS 8461.90.60.40
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Used Czochralski Crystal Puller
A rebuilt machine tool used to grow monocrystalline silicon boules via the Czochralski method by precisely pulling and rotating a seed crystal from molten silicon. It falls under HTS 8461.90.60.40 as a used or rebuilt machine tool working by removing metal or cermets through grinding and shaping processes on crystal boules. This equipment prepares semiconductor material for wafer production.