Rebuilt Wafer Slicing Diamond Saw from Mexico
Refurbished inner-diameter saw with diamond blade for precision slicing of semiconductor wafers from silicon boules. Falls under HTS 8461.90.60.40 as rebuilt sawing machine removing metal/cermets in semiconductor processing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify diamond blade thickness and kerf specs for wafer tolerance compliance
• Provide slicing test data showing sub-micron accuracy
• Declare as semiconductor-specific to avoid general saw classification